Used NOVELLUS / IPEC / WESTECH / SPEEDFAM 472 #9226639 for sale

NOVELLUS / IPEC / WESTECH / SPEEDFAM 472 four-axis wafer grinding, lapping and polishing equipment is a state-of-the-art wafer processing machine. It is uniquely designed to handle a wide range of wafer sizes, up to 300mm in diameter. The system features a direct drive robotic workpiece handling unit, as well as a precision, high-speed, on-the-fly lapping and polishing head. This combination of features provides the user with superior accuracy and repeatability. IPEC 472 is driven by an intuitive graphical user interface (GUI), allowing operators to easily customize and control the machine. WESTECH 472 incorporates several on-board safety systems, including an emergency stop switch and multiple interlocks on the door. It also features a vacuum accumulator for the grinding chamber, allowing for dust-free operation. SPEEDFAM 472 is driven by a powerful CNC controller, which provides precise rotational speed and motion control. The tool further incorporates a multi-zone temperature control asset to ensure uniform thermal conditions across the entire wafer. This ensures the maximum accuracy across the entire lapping and polishing process. NOVELLUS 472 is equipped with an automated media replenishment model, allowing the user to easily switch between media grades. The advanced speed and precision of 472 allows for both wafer grinding and lapping applications, as well as ultra-fine polishing applications for the most demanding applications. NOVELLUS / IPEC / WESTECH / SPEEDFAM 472 incorporates 4-axis control for maximum flexibility and accuracy. It is powered by a sophisticated, dual-head lapping and polishing spindles for up to 12,000 RPM, for working on any combination of wafer orientations and material types. The integrated grinding chambers and multiple lapping heads provide uniform, consistent results each time. In conclusion, IPEC 472 is a powerful, advanced wafer processing equipment, designed to provide users with superior lapping and polishing results every time. Its high-speed and precision, combined with its intuitive design and easy customization, makes it a top-of-the-line solution for wafer grinding, lapping and polishing applications.