Used NOVELLUS / IPEC / WESTECH / SPEEDFAM 676 #293762280 for sale
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NOVELLUS / IPEC / WESTECH / SPEEDFAM 676 is a highly sophisticated wafer grinding, lapping and polishing equipment designed for the semiconductor industry. This six-axis machine can process both two and three-dimensional wafers via diamond and CMP grinding, lapping and polishing of a wide range of materials, including silicon, germanium, gallium arsenide and other compounds. IPEC 676 system is capable of reaching accuracies of 0.0005 inch or better in multi-layer thin film, quartz and even sapphire wafers. The unit is equipped with a rigid spindle drive, robotics, automation and automatic handling of both small and large wafers. It has a reliable self diagnostics machine that allows it to detect any irregularities during the operation and adjust the process parameters automatically for optimal performance and efficiency. WESTECH 676 tool is designed with integrated computer and networking systems that enable complete control of the wafer grinder and other asset components. The locally networked controls allow full automation and remote monitoring of the model functions. Additionally, the wafer grinder has a built-in data acquisition equipment for improved process control, giving the operator real-time feedback on each process step and critical data points. In terms of safety, 676 system is equipped with several safety features such as safety mats, covers, air doors and other safety devices. The wafer grinder is equipped with a fail-safe container to contain any potential debris and coolants or lubricants used. The built-in temperature, pressure and stress sensors enable the unit to self-monitor, detect and protect against any potential risks. This helps eliminate potential operator errors and potential hazards to the environment or personnel. Overall, SPEEDFAM 676 is a highly advanced, multi-axis machine designed for the semiconductor industry. It provides unmatched accuracy, control and safety features, making it a superior choice for precision wafer grinding, lapping, and polishing applications.
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