Used NOVELLUS / IPEC / WESTECH / SPEEDFAM 676 #293814146 for sale

NOVELLUS / IPEC / WESTECH / SPEEDFAM 676 wafer grinding, lapping and polishing equipment is a versatile piece of equipment designed to process semiconductor wafers of various sizes. This system is designed to provide a cost-effective, single-unit platform for all of the processes involved in the fabrication of integrated circuits. IPEC 676 uses a combination of mechanical and chemical processes to achieve the desired surface finish. This machine is equipped with a 6-axis robotic arm designed to move and position a range of tools needed in the production cycle. The arm includes a vacuum-mounted wafer chuck and a variety of tool spindles. Additionally there is a process chamber with integrated pneumatics, variable stage speed control and recirculation, and a range of standard accessories for a variety of process requirements. WESTECH 676 includes a unique computer-controlled grinding tool similar to the traditional lapping systems. Wafers are placed in the chuck, and the robotic arm moves them to the grinding wheel. A computer controls the speed of the grinding wheel as well as the pressure applied to the wafer by using special grinding abrasives. Upon completion of the grinding process, the robotic arm moves the wafer to a chemical lapping process. A chemical etchant is introduced to the wafer that works to remove any remaining debris or residues from the grinding process. Once the lapping process is complete, a polishing step is initiated. The arm positions the wafer against a polishing pad which is abraded with a variety of abrasives to achieve the desired polishing effect. The polishing process further refines the wafer surface and removes any remaining debris left behind from the lapping stage. After the polishing process is complete, a final rinse is applied to the wafer surface. This rinse is designed to remove any polishing residues as well as provide a clean, smooth surface finish. NOVELLUS 676 is designed to provide a highly-versatile, efficient and cost-effective platform to process complicated integrated circuits. This asset employs both mechanical and chemical techniques to achieve the desired surface finish and can support a variety of processes, including grinding, lapping and polishing, depending on the specific integrated circuits being executed. With its robust design and quality components, 676 wafer grinding, lapping and polishing model is an effective solution for semiconductor wafer fabrication.