Used NOVELLUS / IPEC / WESTECH / SPEEDFAM 676 #293830228 for sale

NOVELLUS / IPEC / WESTECH / SPEEDFAM 676 Equipment is a robust, multi-stage wafer grinding, lapping and polishing machine designed for advanced thin wafer processing. It provides reliable, high precision grinds, lapping and polishes for substrates up to six inches in diameter and offers an adaptive speed range of 1,200 to 4,000 RPM. The system is composed of a base unit with a driving mechanism, lapping head, and polishing head; multiple arms for wafer loading/unloading; and various accessory components. A lapping head and two polishing heads provide the necessary platform for substrate processing. The lapping head includes an impermeable vacuum bellow unit which prevents slurry droplets from being either deposited onto wafers, or entrapped within the vacuum bellow. An adjustable speed range (1,200 to 4,000 RPM) allows for precise controlling of lapping and polishing times. The two polishing heads are capable of applying up to 200 lbs of force onto each wafer, providing durability and accuracy during processing. In addition, IPEC 676 Machine includes a vacuum tool for collecting spent grinding materials, as well as an air asset to control component temperatures. The air model is designed to keep temperatures below 110°C and Circulation air volume is adjustable to maximize air flow efficiency. Wafers are also precisely positioned on the lapping head by adjustable clamps, and the machine can be configured for either manual or automatic operation. The machine is well equipped with safety features that include light curtains, emergency stop devices, and risk analysis circuitry that constantly evaluate potential risks to ensure the machine's safety. WESTECH 676 Equipment is suitable for precision thin wafer processing and is ideal for semiconductor and superconducting device mass production.