Used NOVELLUS / IPEC / WESTECH / SPEEDFAM Avantgaard 676 #293635157 for sale

NOVELLUS / IPEC / WESTECH / SPEEDFAM Avantgaard 676 is a high-tech wafer grinding, lapping and polishing equipment designed to produce complex and precise shapes on semiconductor wafers. The system features a grinding unit with a 6-axis, high-performance control, which combines an advanced drive unit and software to achieve accurate, repeatable results. The machine also utilizes a patented force control technology to minimize grinding forces, which helps reduce the risk of chip damage. IPEC Avantgaard 676 has several user-friendly features to simplify operation, such as easy access to the main grinding and conditioning unit, adjustable process speed selection, adjustable pressure settings, and automatic 'stop-go' technology to reduce wear. Additionally, the tool includes 6 different grinding modes, from full-asset grinding to fine tuning, to adapt to the needs of each process. Its ability to self-adjust grinding parameters ensure that the desired outcome is achieved, whether in process development, process adaptation, or component production. The control computer monitors, records, and stores all operation parameters, providing detailed input/output data sets to simplify the manufacturing process. WESTECH Avantgaard 676 is also equipped with safety features, such as an ethernet light curtain, a robust mechanical structure, and an emergency stop device. The model features 2 sets of chucks and 3 sets of servo-driven clamps, all of which work together to assure uniform material removal and polishing. The grinding unit features programmable grinding routes, pressure control settings, and automated operation that simplify the material removal process. A removable spindle allows for simple and easy bit changeovers. NOVELLUS Avantgaard 676 has a higher operating temperature than most other grinders, allowing for improved chip removal. Its advanced filtration equipment ensures that the grinding media and airborne particles are effectively removed from the process. This reduces the possibility of damage to the chips and other components during the grinding process. Avantgaard 676 also offers a choice of grinding media for different application requirements, including diamond, ceramic, and mineral based grinding media. Its large wafer capacity also enables higher throughput and less downtime. Finally, the system can be customized to accommodate multiple product families, providing a cost-effective solution for advanced semiconductor manufacturing processes.