Used NOVELLUS / IPEC / WESTECH / SPEEDFAM Avantgaard 676 #9300859 for sale

NOVELLUS / IPEC / WESTECH / SPEEDFAM Avantgaard 676 (AG-676) is an automated wafer grinding, lapping, and polishing equipment designed for precision machining of semiconductor wafers. It is a hi-tech device capable of achieving micron-level accuracy and repeatability. The AG-676 is equipped with a variety of advanced features, including a powerful robot arm for handling work pieces, as well as a vision-based system for feedback control and automated fault detection. A servo-controlled grinding head with a set of interchangeable grinding disc assemblies is provided, each designed to accommodate different wafer processing requirements. The grinding head has the capability to oscillate the grinding discs at high speed and precisely adjust the angles of rotation, enabling a high level of process accuracy and repeatability. Additionally, the head supports fast changing of the grinding discs in order to minimize process disruption and enable quick switchover between sawblade and grinding stages of the process. The AG-676 is also equipped with an integrated vacuum multi-slot polishing table, enabling quick and consistent operation for a variety of die sizes. The unit is also capable of supported operation of either Hook and Loop or magnetically mounted polishing pads. In addition, the AG-676 features a high-speed robot arm for transport of the wafer from the grinding to the polishing heads. The robot arm has the ability to oscillate at high rates and grip the workpiece securely and accurately, ensuring an optimal mechanism for transportation without creating particle contamination. This also greatly reduces cycle time and improves the machine's throughput. The AG-676 also features an optional vision tool, allowing for automated defect detection and inspection of the wafer prior to and during the process. The asset is capable of capturing images of the wafer at high speeds and comparing the images to set criteria, providing a failsafe model that can detect defects quickly and and accurately. The AG-676 provides excellent value and is an effective and reliable solution for managing wafer grinding, lapping, and polishing tasks. Additionally, the equipment has the capability to accommodate all types of commonly used semiconductor wafer shapes, making it a highly efficient and effective device that offers users improved throughput and reduced costs.