Used NTS GV 320 / PC-VDM #9248791 for sale

NTS GV 320 / PC-VDM is a wafer grinding, lapping and polishing equipment designed for use in the semiconductor industry. The system is capable of controlling the grinding, lapping and polishing process with precision and accuracy. It provides a wide range of capabilities for grinding, lapping and polishing semiconductor wafers from flat substrates to thick layers of silicon. The unit is equipped with a number of sensors to monitor the process and to give feedback on the condition of the wafer. GV 320 / PC-VDM features an automated grinding, lapping and polishing head which is capable of polishing multiple wafers simultaneously. The automated head is driven by a rack and pinion machine, allowing it to move along the Y, X and theta axes. The head is also capable of adjusting the grinding and polishing force as well as the rotational speed. The motorized head is designed to minimize vibration and jitter for high precision grinding and polishing. NTS GV 320 / PC-VDM is also equipped with an infrared rail guidance tool, Mount and Grind feedback control asset and a patented WINDOW method. The infrared rail guidance model ensures a stable and accurate grinding and polishing process. The Mount and Grind feedback control equipment monitors the process and communicates with the grinding, lapping and polishing tool to help reduce start-up lifetimes and provide the consistency needed for high precision wafer grinding. The patented WINDOW method helps improve the uniformity of the wafer surface and also helps reduce the total amount of grinding and polishing time. This system is also capable of controlling three grinding, lapping and polishing processes at once: wet grinding, dry grinding and polishing. It also offers the ability to combine different grinding, lapping and polishing programs to customize the desired wafer finish. GV 320 / PC-VDM includes all the necessary safety equipment ensuring an safe and operator-friendly machine. NTS GV 320 / PC-VDM is a powerful and versatile wafer grinding, lapping and polishing unit. It provides a precise, automated processing solution for wafer production, ensuring consistent quality and uniform surface finish on wafers. By utilizing the Mount and Grind feedback control machine and the patented WINDOW method, it helps to drastically reduce the total processing time while maintaining high precision results.