Used NTS NBM-DSE/2 #293643168 for sale

NTS NBM-DSE/2 is a wafer grinding, lapping & polishing system specifically designed for micro-electronic and optics applications. The modular design of the system allows for a fully automated as well as a manual sample preparation process for thin-film deposition. It can be used to process up to 4 samples at once in multiple carriers. The NBM-DSE/2 is composed of 3 major components; an abrasive disc grind - lapping unit, a polishing plate and a film/polishing pressure generator. It has a robust design, requiring minimal maintenance as well as providing maximum safety while operating. The abrasive disc grind - lapping unit includes 3 motor driven discs which provide maximum grinding performance, eliminating any operational problems due to uneven surface speeds. The discs are mounted on a flexible arm, allowing for a versatile range of producible shapes and sizes for the machined parts. The height of the grinding disc and its position can be adjusted in order to meet the demands of each application. The lapping unit features a reciprocal plate, which is used for lapping and polishing. This plate is composed of two plates, the lapping plate and the polishing plate, with the configuration of the two adjustable to allow for different lapping and polishing angles. The film/polishing pressure generator is used for polishing the surfaces of the sample. It has an adjustable pressure setting in order to generate even and consistant pressures across the whole surface of the sample, hence producing homogeneous polishing results. As well as applying even pressure to the sample surface, the generators also monitor the wear of the abrasive materials, since it is important to keep the polishing results consistent to achieve a high quality finish. Overall, NTS NBM-DSE/2 is a compact and efficient machine, suitable for applications in many different industries such as micro-electronic, optics and thin-film deposition. It is accurate, easy to operate and configure, ensuring a simple, safe and fast wafer grinding, lapping & polishing process.