Used NTS NML-3020 #9364614 for sale

NTS NML-3020 Wafer Grinding, Lapping & Polishing Equipment is one of the most advanced systems available. This system is designed for precision polishing of both flat and curved surfaces on semiconductor wafers. NML-3020 is equipped with a 120 mm precision lapping plate for lapping of wafer backside surfaces, and a diamond disc wheel for polishing of backside, edge rounding, and notch area of the wafer. NTS NML-3020 unit is equipped with two vertical spindles (100mm) and one horizontal spindle (50mm) for allowing multi-directional grinding and polishing. The grinding spindles are driven by a brushless servo motor for fast and precise positioning, and the two grinding wheels have different characteristics and size. The main lapping wheel (Diamond Disc Wheel) is constructed of an abrasive diamond ring with a wide range of abrasive materials such as diamond, alumina, silicon oxide, and polycrystalline diamond (PCD). The grinding force is controlled by a pressure transducer to auto-adjust the deflection of the grinding wheels and prevent step-over. The wafer disc wheel is loaded into the main lapping wheel in the machine and can be set to a specific pressure for precise and repeatable grinding and lapping. NML-3020 is equipped with two gas Atomizers and a rotational speed selector box for uniform polishing of the wafer edges and notch areas. Real-time video feed is available for monitoring of the polishing process. The machine is equipped with a wafermap software program to store all polishing coordinates and take them as reference for future processes. NTS NML-3020 is designed with a variety of safety devices and countermeasures to ensure the highest quality of wafer grinding, lapping and polishing. The tool is equipped with vibration sensors, temperature and pressure monitors, and a leak detector, as well as a dust-handling asset. NML-3020 model is suited for a variety of applications such as dielectric etching, barrier etching, metalizing, chemical/mechanical polishing, back grinding and polishing, and coverage etching. The equipment is designed to provide optimal results for both reliable polishing and high yield rates.