Used NTS NSC-2028O #9279255 for sale

NTS NSC-2028O is a powerful and highly advanced wafer grinding, lapping and polishing equipment. This system was designed specifically for high-precision and ultra-fast wafer processing. It is able to process all different types of semiconductor and crystalline materials with extreme accuracy and precision. NSC-2028O is capable of achieving sub-micron flatness and surface uniformity with minimal debris and slurry residues. NTS NSC-2028O has a generously sized wafer carrier with 24-inch diameter capacity, which is ideal for larger wafers. This feature is particularly important for accurate wafer alignment and uniform processing. The unit also boasts a diamond particle polishing module that delivers exceptional polishing accuracy. The advanced diamond suspension machine is specifically designed to hold the diamond particles in suspension and evenly disperse them across the wafer surface, ensuring that all particle pressures remain consistent. The tool also features automated slurry control. This allows for precise slurry delivery rates and allows for quick and easy slurry exchange between different types of wafer material. The automatic control also helps to reduce wafer-to-wafer processing time. NSC-2028O is also fitted with an advanced vacuum asset that helps to keep particles and debris pressure maintained at low levels. This ensures the optimal working environment for the model. NTS NSC-2028O includes a precision-engineered single-rotation motor that is powered by a high-grade servo-controlled drive. This powerful motor enables powerful grinding and lapping of the wafer without damaging the material. The equipment also includes a variable speed adjustment that allows for maximum process variability and adaptability. Finally, NSC-2028O lives up to its name by including an automated wafer inspection module. This highly advanced module allows for a thorough inspection of the wafers after completion of the grinding, lapping and polishing process. The module is fitted with high-resolution, multiple cameras, providing excellent resolution and accuracy. This allows any flaws or imperfections to be quickly identified and corrected before final delivery of the wafers.