Used NTS NSCL-1100 #293650742 for sale

NTS NSCL-1100 Wafer Grinding, Lapping and Polishing equipment is designed for applying advanced techniques to a variety of materials and applications. This advanced system provides efficient and accurate flatness control, optimal surface finish, and excellent surface uniformity and quality. NSCL-1100 is equipped with a high-precision, multi-axis CNC controller and has a positioning resolution of 0.001 μm. This allows for an extremely stable and accurate grinding and lapping/polishing process. The advanced CNC controller also enables the operators to easily program and set parameters such as surface roughness, grinding speed, and feed rate. NTS NSCL-1100 feature an 11" max wafer diameter and can grind, lap, and polish wafers up to 1000μm thick. The wafers are loaded onto a belt-driven spindle, which rotates the wafer during grinding and lapping/polishing stages. NSCL-1100 features a high-performance vacuum unit that efficiently removes the grinding media and lapping/polishing slurry, resulting in a clean and debris-free surface. Additionally, the machine is compatible with a variety of different grinding or polishing media and slurries, allowing optimal process performance. NTS NSCL-1100 is constructed with a heavy-duty aluminum frame with a stainless steel interior and all components are protected from dust and dirt. A stainless steel wafer tray is included for wafer handling and a chiller/heater tank is included for cooling or heating of abrasives and lapping/polishing slurries. NSCL-1100 also features an integrated spindle load and pressure sensor, which allows for accurate and repeatable lapping/polishing operations. NTS NSCL-1100 is the perfect tool for a wide variety of processes, from first level lapping/polishing to high-precision wafer grinding. With its advanced CNC controller, efficient vacuum tool, and variety of grinding/polishing materials, NSCL-1100 provides superior performance and quality.