Used NTS NSL-2020 #293765738 for sale
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ID: 293765738
Lapping machine
Lapping plate: Φ510×Φ180 (IDxOD)
Ring size: Φ200xΦ162
Lapping plate: 20-150 RPM
Motor drive power: 2.2 kW, 220 V, 3 Phase
Water cooling temperature
Accessories:
Dust cover
Duct hood system
Precision variable multi-step pressure mechanism
Standard plate facing
Grooving system
Wafer thickness eccentricity prevention function: 2 µm
(2) Holder pneumatic pressures
Vacuum chuck type
(2) Holder motor drive systems
Oscillation system
Control: PLC and programming touch screen (HMI)
Consumables:
Copper: 20" x 1/2"
Ceramic conditioning ring NCR-103 for 20"
Diamond slurry roller pump drop system
Auto-stirrer
(2) Slurry tubes: 15 m
Facing bite radius: 60 x 0.3
Power supply: 220 V, 3 Phase, 50/60 Hz.
NTS NSL-2020 is an innovative wafer grinding, lapping, and polishing equipment ideal for mass or low-volume production of wafers from any material. This system offers very thin (as low as 5µm) and high quality surface finishes. NSL-2020 features 2-axis numerical control (NC) for automatically controlling the spindle speed and workpiece positioning, providing a high degree of accuracy and repeatability. This offers a high degree of flexibility and cost savings when it comes to wafer grinding, lapping and polishing. NTS NSL-2020 is equipped with a coolant reservoir and filter unit that allows for the efficient cooling of wafers which helps to protect them from thermal shock and ensure their longevity. It also allows for a more consistent and controllable grinding and polishing process. The coolant reservoir and filter machine also helps to protect the grinding and polishing components from the abrasive dust and other contaminants in the air. NSL-2020 also features an in-line polishing compound feeder that supplies polishing compounds for grinding, lapping and polishing at the same rate as the grinding process, ensuring a consistent finish across multiple wafers. This in-line feeder also helps to reduce the total cycle time for the entire process. NTS NSL-2020 also features a high-resolution CCD camera that allows for the easy and accurate detection of fine defects. This helps to ensure a high degree of quality control during the grinding, lapping and polishing process. To help prevent damage to the wafers and maintenance of the machine, a wear monitoring tool is included with NSL-2020. This asset periodically checks the wear on the grinding and polishing components and automatically downloads this data to the PC. NTS NSL-2020 is also equipped with a PLC controller that allows for real-time process monitoring and control. This controller also allows the user to modify and customize the grinding, lapping and polishing profiles depending on the specific requirements of the wafers. All of these features, combined with the high degree of precision and accuracy, make NSL-2020 an ideal solution for mass production and/or low-volume production of wafers from any material. It also ensures a consistently high quality of wafers, with minimal defects and a high degree of uniformity.
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