Used NTS NSL-2020 #9237936 for sale

NTS NSL-2020 is a world-class wafer grinding, lapping, and polishing equipment. It is specifically designed for the production of ultra-fine, nanometer-level tolerances on semiconductor wafers. This system combines advanced technologies and state-of-the-art technologies with robust design engineering and quality construction. NSL-2020 is designed to process wafers up to 12" in diameter, with a 8-Grit processing option. The unit allows simultaneous grinding, lapping, and polishing of a wide breadth of materials, including but not limited to, SiC, GaAs, and Sapphire. NTS NSL-2020 uses several innovative automation processes, such as a robotic wafer lift machine, auto lapping, real-time wafer/process monitoring, and process completion verification. This tool also incorporates an auto-load/unload, automatic tool selection, and other features to help streamline the process. Additionally, the machine features digital process control, with the ability to both monitor and program parameters for various process combinations. NSL-2020 consists of three major processing stations: grinding, lapping, and polishing. The grinding station quantitatively removes process-specific thin layers of material from the wafer. The lapping station precisely etches arrangements of micro-diamonds, eventually creating a flat surface on the wafer. Finally, the polishing station uses diamond-abrasive pastes to obtain nanometer-level tolerances. The asset is also equipped with chambers to help control the pressure, spin rate, and temperature of the wafer during each stage of the process NTS NSL-2020 is backed by comprehensive after-sale service, as well as a commitment to customer satisfaction. The user-friendly design ensures that operators are able to easily learn the model, and its automation minimizes user intervention. Its energy-efficient design costs less to run, while the easy maintenance and quality components ensures its long life-cycles. All in all, NSL-2020 is an advanced and reliable wafer grinding, lapping, and polishing equipment. It offers efficient, cost-effective production of ultra-fine nanometer tolerances on a variety of semiconductor wafers, from the simplest to the very challenging processing steps. Its user-friendly design, processing speeds, and quality construction make it an ideal system for any nanotechnology application.