Used NTS NSL-2024 #293650745 for sale

NTS NSL-2024 is a fully automated, open-architecture, multi-functional wafer processing equipment that specializes in grinding, lapping, and polishing of wafers up to 8" in diameter. It is designed to meet the production needs of advanced semiconductor applications and ensuring high quality end products in the most efficient manner possible. NSL-2024 is equipped with a semiconductor grade vertical spindle motor for lamination and grinding processes, and an adjustable speed belt conveyor for transporting the semiconductor wafers across the processing area. The integrated spindle is designed to provide low vibration and noise levels to ensure that wafer treatments are done with minimal detrimental effect. The system is equipped with dual-sensor detection capabilities for automated wafer loading and unloading, as well as a fully automated QDrive unit for managing the grinding and polishing treatment of the wafers. The machine is also capable of providing granularity control for each lapping or grinding task in order to optimize end-to-end production. This tool also offers versatile in-situ polishing capabilities, which allow for the processing of various types of polishing pads, such as diamond and copper. The versatile asset also utilizes a combination of high-pressure and low-pressure processing steps to achieve the desired output. NTS NSL-2024 is also equipped with an advanced data management model, allowing users to quickly recall and adjust the settings of previous jobs to ensure reliable and consistent wafer processing. NSL-2024 is a user-friendly and reliable equipment, which is easy to install. The system is also well-suited for use within cleanroom environments, meeting class 10 blow ambient requirements. Additionally, the unit offers minimal maintenance needs, making it a cost-effective and efficient choice for wafer grinding, lapping, and polishing purposes in the semiconductor industry.