Used NTS NTFM-400FND #9237933 for sale

NTS NTFM-400FND is a multifunctional machine specifically designed to provide efficient wafer grinding, lapping and polishing solutions. This advanced equipment is specifically engineered for semiconductor device production applications such as grinding, lapping and polishing of wafers, silicon chips, ceramic substrates, film and various other materials. NTFM-400FND utilizes a high-efficiency abrasive machining process that provides a high degree of precision and accuracy through advanced control and monitoring techniques. The integrated grinding hardware consists of two main components; the grinding table (plate) and the grinding wheel, both of which are powered by a high-precision servo motor. The grinding wheel is connected to the grinding table via a modular clamping system, in order to achieve a high degree of rigidity and accuracy. The integrated lapping process is driven by a Focused Ion Beam (FIB) unit which ejects controlled ions at the workpiece surface in order to achieve sub-micron scale precision lapping. This advanced machine is further equipped with a direct displacement measurement tool (DDMS) which actively monitors and adjusts the abrasive motion for efficient wafer lapping. The integrated polishing process creates a super-smooth finish on wafers, for advanced device production technologies. This is achieved via a combination of computer-controlled precision polishing motion and nano-abrasive material. NTS NTFM-400FND also contains a variety of safety features, such as pressure and motion sensors, to ensure that the machine is operating at optimal capacity with minimal risk of harm or operator error. Overall, NTFM-400FND provides an effective and safe production solution for wafer grinding, lapping and polishing, through its combination of advanced control and sophisticated technologies. This multifunctional asset is a reliable choice for meeting task-specific requirements.