Used NTS NTFM-460FND #9248453 for sale

NTS NTFM-460FND wafer grinding, lapping and polishing equipment is an integrated system that is designed for high accuracy and repeatability in the grinding, lapping and polishing processes that are essential in the wafer production process. The unit utilizes the latest grinding, lapping and polishing technology to achieve precision results with a high throughput. The machine is capable of producing high yields while efficiently reducing the time required per piece part. Robotic Integration: NTFM-460FND utilizes a 6-axis robot to automatically load and unload wafers from the grinding and lapping workstations, as well as to transport the finished parts to the pallet. This automation alleviates the need for manual labor and allows for higher throughput and improved consistency. Grinding/Lapping Capabilities: NTS NTFM-460FND features grinding and lapping capabilities that provide superior surface finish and topography. The grinding/lapping spindle is powered by a brushless AC motor with high-speed rotation of up to 15,000 rpm, capable of removing material efficiently and accurately. The wafer is automatically clamped while the grinding/lapping takes place. Polishing Capabilities: NTFM-460FND has a fully integrated polishing tool that is capable of removing material and achieving the desired surface finish. The asset features both manual and fully automatic polishing capabilities. The polishing head is equipped with two separately controlled motors for independent polishing force adjustment. The polishing sequence is fully programmable, allowing for precise polishing results.Model Features: NTS NTFM-460FND is equipped with several features designed to enhance and streamline the grinding, lapping, and polishing processes. The equipment is able to keep track of wafer production with an integrated data logging software. The system also offers automatic wafer calibration and positioning for improved accuracy. The machine's graphical interface allows for easy operation and visual monitoring of the polishing process. Finally, a variety of options are available including exhaust systems, material handling, and other accessories. NTFM-460FND provides advanced grinding, lapping and polishing capabilities that are designed to provide consistently precise results and high throughput. Its features ensure that the process is efficient, repeatable and reliable and it is ideal for precision wafer production.