Used NTS SL510T-AFCLOM #293643166 for sale

NTS SL510T-AFCLOM is a specialized equipment designed specifically for wafer grinding, lapping, and polishing. It is an automated process-control machine capable of making a wide range of wafers from 25mm to 150mm in diameter. The system is equipped with a vacuum handling station and automated chuck for secure gripping of the wafer substrate. It has an automatic loading mechanism for the wafer substrate. The unit is also equipped with a grinding station for rough grinding, a lapping station for fine grinding, and a polishing station for polishing. The grinding station is equipped with a horizontally and vertically adjustable chuck. It can handle wafers of various thicknesses. The grinding station uses a diamond-studded grinding disk to remove material from the wafer. The grinding disk can be adjusted to grind both sides of the wafer simultaneously. The lapping station is equipped with a litho lapping plate and a high-precision indexing machine to ensure uniform lapping of the wafer substrate. It can handle both single-sided and double-sided lapping. The lapping plate is fitted with interchangeable cutting inserts which are used to achieve a desired lapping finish. The polishing station is equipped with a polishing table and atomized polishing media. It is capable of simultaneously grinding and polishing both sides of the wafer. It can handle both single-side and double-sided polishing processes. The polishing media is atomized to ensure uniform polishing of the wafer. The tool also includes an advanced control asset for adjusting the process parameters such as speed, time and pressure. This ensures consistent and reproducible processes. All parameters are automatically monitored and recorded and can be retrieved from the model if needed. SL510T-AFCLOM is a powerful and versatile machine for making wafer substrates for electronic applications. It is optimized for precision and repeatability and is capable of high throughput with minimal operator intervention. Its compact design is able to fit into small areas and the equipment offers a complete solution for high-volume wafer grinding, lapping, and polishing needs.