Used NTS SL610T-AFCL #9158754 for sale

ID: 9158754
Vintage: 2009
Lapping machines 2009 vintage.
NTS SL610T-AFCL Wafer Grinding, Lapping & Polishing Equipment from National Test Systems (NTS) is designed for advanced material preparation processes in the semiconductor industry. The system is composed of several main components, which include: grinding discs, a top wafer holder, a bottom wafer holder, an abrasive slurry reservoir, a fluid reservoir, and pneumatically released straps to hold the wafer during lapping and polishing. The grinding disc is capable of simultaneous grinding for both sides of the wafer with fine polishing grade diamond blades. The top and bottom wafer holders evenly distribute the pressure on the wafer to ensure minimal distortion. The slurry reservoir supplies the polishing media necessary to glide the wafer as it moves along the rotating disc(s). The fluid reservoir supplies a coolant on the disc underneath the wafer to ensure heat generated during grinding does not cause damage to the wafer's surface. The pneumatically released straps hold the wafer in place during the lapping and polishing cycle by pressing the wafer onto the grinding disc. This unit enables efficient grinding, lapping, brushing and polishing of semiconductor wafers in a single, automated process, without any manual intervention. After grinding, the wafers can be returned to the seed layer through electroless deposition of an electrochemical layer. Furthermore, by using the desired level of polishing slurry, the machine produces high quality, low roughness surfaces, thereby removing surface irregularities and creating finely finished products. SL610T-AFCL allows automated wafer processing, saving both time and cost. It features sophisticated control systems, for safety and repeatability of results. It processes wafers up to six inches in size with very precise dimensional control and +/-3μm accuracy. The tool's various sensitivity procedures enable accurate grinding, lapping and polishing even on fragile and difficult materials such as silicon, gallium arsenide and silicon on insulator (SOI).
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