Used NTS SP510T-AFCLOM #293643167 for sale

NTS SP510T-AFCLOM is an industry-leading wafer grinding, lapping, and polishing equipment designed for the production of perfectly flat, ultrasmooth surfaces on a variety of semiconductor materials. It is capable of processing diameters ranging from 150mm (6") up to 600mm (24"). The entire system is pneumatically operated and its modular design allows for flexible integration into production lines. The wafers are supported between flat modular carriers, which can be reprogrammed to accommodate different wafer shapes, thicknesses and sizes. The wafers are placed onto the rotating spindle, while the mounted carrier keeps each disk in a fixed position in order to avoid fragmentation of the disk surface during the grinding process. The top and bottom wheel hold the wafer and drive it through two precision-machined and aligned concentric circles. The wheel pressures are adjustable from 0.03 MPa (4.3 psi) to 0.15 MPa (21.8 psi). SP510T-AFCLOM also features a lateral or vertical cutting blade, which can be used for removing any imperfections or uneven parts of the surface. Controlled removal of material from the wafer's edge is achieved by the adjustable carrier spin rates and abrasive feed rates. The unit supports a wide range of grinding, lapping and polishing processes, such as flat lapping,fine lapping,polishing and single-stage application polishing. The grinding speed can be controlled in increments of 0.01 μm/min and the polishing forces are adjustable from 0.03 MPa (4.3 psi) to 0.15 MPa (21.8 psi). A wide range of abrasive remover materials are available, allowing different grains and grit levels to be employed. In addition, the SP510T-AFCLOMcan save up to 9 programs with up to 10 steps each, providing a production efficiency and flexibility. This is achieved by a setup procedure through a touch screen display with a user-friendly graphical interface. Finally, the machine can be integrated with PCs for remote operation and for data exchange. NTS SP510T-AFCLOMwafer grinding, lapping and polishing tool is among the most advanced available in the market today. It is ideal for applications requiring precise surface finishing on semiconductor materials, allowing for a perfect and efficient production of flat, ultrasmooth surfaces.