Used OBSIDIAN Flatland 501 #65509 for sale

OBSIDIAN Flatland 501 is a wafer grinding, lapping, and polishing equipment designed to enable rapid, high precision flat polishing of large size semiconductor and optoelectronic device substrates. The system retains an excellent clearance distance between the platen and substrate, while maintaining a high level of uniformity and accuracy in the grinding and polishing process. The unit consists of a single Continuous Flatland lapping machine employing a two-head lapping disc configuration with integrated planetary head rotation. The motor-driven flatland lapping machine processes one substrates at a time, and the overall machine is highly automated and easy to use. Flatland 501 is equipped with a sophisticated control tool that provides precise control over all process parameters, including the applied force, feed speed, amount of material to be removed, and lapping angle to ensure optimal performance and maximum effectiveness in the lapping and polishing process. The asset also features a very small footprint, which allows for efficient installation and operation, even in limited space environments. The model is designed to accommodate both standard and custom configurations, and contains numerous safety features to promote optimal safety in both the operator and the substrate. These include an alarm equipment, emergency button, and a hygienic design with protective covers that prevent contamination of the substrate. OBSIDIAN Flatland 501 is a powerful tool in manufacturing that provides precision lapping and polishing of substrates of all sizes. It is designed to achieve precise and repeatable results and to minimize operator fatigue, process variability, and overall costs, making it an ideal choice for those seeking a fast, reliable, and high-precision solution for their substrate polishing needs.