Used OKAMOTO 124N #9003313 for sale

OKAMOTO 124N is an automated wafer grinding, lapping and polishing equipment designed for fast, precise and large-scale diamond processing. This system is a perfect choice for those who need to produce highly precise lapping and polishing of wafers. This unit offers the optimal combination of productivity, quality, and cost, making it an ideal choice for fabrication shops that need to rapidly process a large number of wafers. 124N offers two different grinding, lapping and polishing functions. The unit is equipped with an integrated spindle and grinding wheel. The spindle has a variable speed drive control machine that delivers precise speed and force control. This allows for fast and accurate grinding, lapping and polishing of wafers. The unit is also equipped with a variable speed head that has a feed-play control which allows for precise control of the diamond or lapping wheel. This provides the best control for optimal grinding, lapping and polishing of the wafer surface. The lapping plate is also adjustable, allowing for precise alignment and the ideal amount of contact between the lapping plate and the wafer. This helps to ensure even grinding and polishing of the wafer surface. The tool is also capable of automated operation, with a programmable display giving the operator complete control over the process. This makes it easy for operators to set the desired parameters and monitor the progress of the grinding, lapping and polishing process. OKAMOTO 124N is incredibly efficient and is designed for applications in all types of industries, producing the highest quality and precision when it comes to lapping and polishing wafers. The powder collection asset helps ensure a minimum of dust is produced during operation and has an easy release and clean up cycle. This automated wafer grinding, lapping and polishing model is a great choice for laboratories and industrial production that require the highest quality and precision, and is designed to give you consistently excellent results, no matter the task. With its precision control options and automated operation, 124N is an excellent choice for all types of wafer grinding, lapping and polishing applications.