Used OKAMOTO 450 #170190 for sale

OKAMOTO 450 is a wafer grinding, lapping and polishing equipment designed for single-wafer processing. The system is capable of handling wafers up to 450mm in size and is built with performance, accuracy and consistency in mind. 450 is easy to operate and maintain, enabling efficient production. The grinding section of the unit includes four grinding/polishing discs, a single rotary table, an automatic feed machine and an extendable protective cover. The discs are arranged so that the grinding, lapping and polishing operations are conducted separately. The discs are designed to provide superior wafer surface quality and production speed and are optimized for maximum efficiency. The rotary table allows for continual feed of wafers and the automatically adjusts the table speed in order to maintain a consistent process. The extendable protective cover provides a safe environment for wafer processing. The lapping section utilizes four lapping plates and two adjustable support arms, allowing for uniform lap plates pressure and superior surface finish. In addition, a water cooling tool and pump are available to maintain precise temperature conditions and reduce the risk of thermal damage. The adjustable support arms can also be used to adjust the lapping angle, ensuring that the best possible lapping results are achieved. The polishing section is also designed for precise wafer processing, featuring a special polishing unit, adjustable support arms and an air knife for uniform pressure and efficient polishing results. An adjustable pressure asset is also included to ensure consistency in the polishing operation. OKAMOTO 450 is highly customizable and can be adapted to various semiconductor applications. The model is a reliable and efficient solution for the most precise wafer processing requirements. Its combination of production speed, accuracy, consistency and cost-effectiveness makes 450 an ideal choice for semiconductor manufacturing.