Used OKAMOTO 502 #293595782 for sale

OKAMOTO 502 is a precision wafer grinding, lapping and polishing equipment designed for small and medium-sized productions. The system provides high-precision processing of wafers up to 200mm in diameter, with a repeataccuracy of 0.25 μm and workpiece flatness of only 0.1 μm. The grinding process uses concentric rotary diamond wheels with metal bond, suitable for processing various materials, including semiconductors, optoelectronics, LEDs and magnetic materials. These wheels are mounted on a separate, independently driven spindle for grinding, lapping and polishing, thus allowing for maximum precision, flexibility and repeatability. The unit features modular construction, allowing for individual design of the equipment. Its standard configuration includes two spindles for grinding, lapping and polishing, two workstations for manual loading and unloading of workpieces, and a powerful inverter-controlled digital motor that controls the movement of the grinding wheel. The machine also features adjustable head speed and rotational torque, allowing for finely tuned grinding, lapping and polishing for a wide range of materials. The innovative dual-wheel design ensures perfect concentricity, thus improving part surface finish and reducing polishing time. 502 is a highly reliable tool, designed to eliminate stalling or slippage of the work piece. The asset also employs a comprehensive range of safety features, such as over-current protection, safety switch to power off the motor, and emergency stop button. The model features a fully automated CNC production process, allowing for easy set-up and loading of wafers. Additionally, a comprehensive range of software options is available, allowing for real-time monitoring, data logging and process control. Overall, OKAMOTO 502 is a precision wafer grinding, lapping and polishing equipment designed for small and medium-sized productions. The system provides high-precision processing of wafers up to 200mm in diameter, with a repeataccuracy of 0.25 μm and workpiece flatness of only 0.1 μm. The unit's modular construction and range of software options makes it an ideal solution for a variety of precision grinding, lapping and polishing applications.