Used OKAMOTO 502 #293608652 for sale

OKAMOTO 502 is a wafer grinding, lapping and polishing system designed to combine the process of grinding, lapping, and polishing in a single, compact machine. 502 consists of the grinding unit, a built in lapping unit, and the polishing unit. The features of OKAMOTO 502 include a high-precision grinding wheel with a wheel hub that has a diameter of 500 millimeters, a wheel speed ranging up to 120 meters per second and a wheel travel speed of up to 120 meters per minute. Additionally, 502 houses two linear slides which guarantee highly accurate travel and fine control. The integrated lapping unit enables single-sided and double-sided flat lapping, which can be optimally adjusted to give high quality results. The lapping wheel is fitted to the guide wheel via a magnetic connection, allowing for effortless wheel removal. The lapping wheel speed is 20 metres per second, with a maximum wheel travel speed of 12 metres per minute. The polishing unit features a sliding mechanism with a wheel diameter of 360 millimeters and a wheel speed of 5 metres per second. Additionally, it offers the option of single-sided and double-sided polishing. The wheel travel speed can be adjusted up to a maximum of 250 millimeters per second, giving results of up to 500 millimeter lengths per hour. OKAMOTO 502 is a high performing, versatile system for grinding, lapping and polishing. Its powerful grinding wheel enables precise and fine workpiece profile control. The integrated lapping unit delivers high accuracy single and double-sided flat lapping and the polishing unit provides single and double-sided the precise polishing results. The system can be used for efficient and cost-effective machining of brittle and hard materials, such products as Sapphire, Quartz or Boron Nitride. With the innovative technology and precise engineering, 502 strives to meet the highest industry and customer satisfied standards.