Used OKAMOTO 502 #9396144 for sale

OKAMOTO 502 wafer grinding, lapping, and polishing equipment is a versatile, automated solution for surface preparation of various substrates. The system is provided with either manual or fully programmable control. 502 has a compact design and uses a single, central motor for smooth and reliable operation. It offers grinding, lapping, and polishing capabilities, and is capable of processing substrates in various sizes, shapes, and thicknesses. The primary components of OKAMOTO 502 are the grinding and polishing wheel, the lap plate, and the spindle. The grinding and polishing wheel is powered by a single motor that is capable of delivering high torque in both directions for efficient grinding and polishing. The wheel face is constructed from a diamond binder material, which ensures superior performance and dependability. The lap plate is designed to hold wafers during the process and is lined with a non-scratch material for added protection. The spindle is engineered to be smooth in operation and offers maximum rigidity and thermal stability for reliable material processing. 502 offers flexible process control, with an intuitive user interface and real-time process monitoring and analysis. The programmable logic controller (PLC) allows users to adjust feedrates, process cycles, and other parameters to ensure consistent process results. In addition, the unit is provided with advanced safety features such as an emergency stop function that stops rotation of the grinding/polishing wheel, protecting the substrate and operator from harm. OKAMOTO 502 is ideal for wafer processing applications such as die attach, epitaxy, polishing, and backside lapping. The machine's innovative design and advanced technology provide a reliable surface preparation solution that can efficiently achieve high quality results. With its simple operation and maintenance, 502 is an economical choice and is a trusted tool for production and research alike.