Used OKAMOTO 6.12/14 #9209179 for sale

OKAMOTO 6.12/14 Wafer Grinding, Lapping & Polishing equipment is a machine tool designed to produce a highly precise, parallel and flat surface finish on mechanical components such as silicon wafers. It is a fully automated system, capable of carrying out multiple simultaneous processing operations on multiple workpieces. The unit is constructed of base, machine head, and motor housing. The base houses the grinding and lapping wheels, while the machine head and motor housing hold the process control components, as well as the spindle motor needed to power the grinding and lapping process. The machine has a range of grinding and lapping wheels with a diameter of up to 6.00 inches. They are mounted onto a 360-degree rotary table which can accommodate up to 4 wafers. This table is driven by a high speed spindle motor. The machine is also equipped with a dust extraction blower which ensures that the grinding and polishing dust build-up is minimal. The grinding and lapping process itself is carried out through a closed-loop, 2-axis looping machine. This tool uses an array of sensors and automated control systems to precisely control the grinding and lapping process. The closed-loop nature of the asset ensures a high degree of accuracy, allowing for the production of highly precise wafers. The model is designed for easy maintenance; its components are simple to access and can be easily cleaned, tested and maintained. All the electronic components can be quickly replaced if necessary. Also, all the machine functions can be accessed via the touchscreen/LCD display. OKAMOTO 6.12/14 Wafer Grinding, Lapping & Polishing equipment is a sophisticated and powerful machine tool with the potential to produce a range of highly precise and accurate components. Its numerous benefits - ease of maintenance, closed-loop control system and advanced features - ensure that users of the unit can be confident of producing a high standard of components.