Used OKAMOTO ACC-124N #9208311 for sale

OKAMOTO ACC-124N is a wafer grinding, lapping and polishing equipment that is designed to produce high quality precision results for a variety of applications. This system is ideal for processing wafers of various sizes, up to and including 200mm. ACC-124N utilizes a high speed, two-stage grinding process utilizing diamond grinding and then lapping and polishing with a selection of tools, all of which can be quickly and easily changed. The unique two-stage processing allows for high precision and repeatability, even when dealing with very thin wafers. OKAMOTO ACC-124N is a highly automated unit with many of the operations being handled through the intuitive touch-screen user interface. The machine is also fully integrated with a number of process monitoring and control systems, allowing for very precise process control and advanced automation capabilities. The tool is also extremely reliable and accurate, employing several force and torque sensors to monitor and control the grinding and polishing processes. ACC-124N is designed with safety in mind, utilizing a series of alarms and warning systems to alert operators of potential hazards. The asset also has a comprehensive dust collection model, removing potential health hazards and ensuring a safe working environment. OKAMOTO ACC-124N is also extremely energy-efficient, operating on a low voltage DC supply while remaining very efficient. The equipment also utilizes high quality components and advanced design elements, making it a reliable and cost-effective solution for precision wafer processing. In short, ACC-124N is a highly efficient and reliable wafer grinding, lapping and polishing system that is designed for users who are seeking high precision results. The unit's automated capabilities, advanced process control and monitoring systems, and safety features make it well-suited for a wide range of precision wafer processing applications.