Used OKAMOTO ACC 24-60EX #9381571 for sale

OKAMOTO ACC 24-60EX is one of the latest machines developed for wafer grinding, lapping & polishing. It utilizes advanced technologies to perform a series of operations in the fabrication of planar semiconductor components. This machine is equipped with a high-precision direct drive stage that guarantees a uniform motion with excellent repeatability and positioning. ACC 24-60EX includes an automated 8-inch, three-jaw, clamping chuck that minimizes surface wobble during operations. It also features an auto-detection function to quickly determine the number of blades needed to perform the operation. OKAMOTO ACC 24-60EX features a series of spindles of different speeds to provide high-precision grinding and polishing. An independent motor is equipped for each spindle in order to minimize vibration during operation. In addition to this, the machine has a programmable travel control which allows for precise grinding and polishing operations. This feature is used to control the amount of material to be removed and also helps to minimize the grinding depth. ACC 24-60EX also has a self-leveling wafer table which ensures consistent flatness of the wafer surface. Furthermore, the machine is capable of performing multiple grinding and polishing operations simultaneously and can accommodate up to two wafers at a time. This feature enhances the throughput rate and ensures a high-yield operation. Finally, OKAMOTO ACC 24-60EX also has a built-in dust collection system, which collects the dust particles generated during the grinding and polishing operation and then removes it from the machine. This helps to maintain a clean and safe working environment. ACC 24-60EX is a state-of-the-art machine that is ideal for performing wafer grinding, lapping & polishing operations with high efficiency and precision. It is equipped with an array of features that help to maximize the yield and throughput rate of operations while maintaining a clean and safe working environment.