Used OKAMOTO ACC 450-B #170175 for sale

OKAMOTO ACC 450-B is a high-precision wafer grinding, lapping, and polishing equipment designed for the manufacture of photomask substrates. The system is suitable for a range of manufacturing tasks, including the machining of hard, brittle materials such as glass, quartz, and ceramics, as well as semiconductors. ACC 450-B utilizes a direct-drive grinding wheel and an interchangeable polisher head to provide a versatile and robust platform for wafer processing. The unit is capable of grinding and lapping wafers up to 450mm in diameter with a maximum deviation of as little as 2 microns. The high-precision grinding wheel is constructed from Diamond or CBN and is driven by a high-torque torque motor and encoder feedback, facilitating smooth and accurate operation. OKAMOTO ACC 450-B is also equipped with a high performance, polisher head capable of achieving a finish of less than 1 nanometer. The machine has also been designed for process versatility, with full control over process parameters such as drive speed and down force, as well as the ability to accommodate both fixed and variable speed polishing. ACC 450-B is an industrial-grade wafer processing tool designed for the manufacture of photomask substrates and other demanding applications. Its rugged construction and reliable performance ensure a quality finished product with accurate and reproducible results. The highly versatile asset can be deployed to grind, lap, and polish a variety of materials to a broad range of diameters and specifications, with a maximum deviation of as little as 2 microns and a finish of less than 1 nanometer. OKAMOTO ACC 450-B is an efficient, rugged, and reliable solution for the precision machining of hard, brittle materials.