Used OKAMOTO ACC-6 18DX3 #9390531 for sale

OKAMOTO ACC-6 18DX3 is a precision wafer grinding, lapping and polishing equipment used for a variety of applications from wafer level packaging to solar cell production. This high-accuracy fine grinding and polishing system is suitable for both manual and automatic operations, features a 3-axis machine table, and utilizes OKAMOTO precision diamond grind stones for superior surface finish and flatter films. The grinding unit consists of an ACC-6 18DX3, an ultra-precision grinding head, a main motor, a digital AC servo motor with a feed drive, and a selection of grinding disks. The grinding head uses a grinding wheel set at a precise angular velocity for each application, allowing for the achieved surface finish and uniformity needed for the customer's product. The grinding wheel is powered by a digital AC servo motor and feed drive, which accurately controls the wheel's speed and feed rate. The lapping and polishing machine utilizes a combination of chemically treated discs and abrasives to achieve the desired finish. The lapping process integrates multiple material removal techniques, including grinding, abrasion, and lapping. In addition, the use of a compound loaded lap on the grinding disc allows for a controlled and uniform removal rate of material while still achieving the desired flatness. The 18DX3 also rapidly processes wafers and can process up to 12 inch diameter wafers with a 0.95um Ra and 15nm surface roughness. Since it is also equipped with a rotary table, it can process two wafers at the same time for faster processing. In addition, the polishing process is also automatic with the touch of a button so that time and labour are significantly saved. OKAMOTO ACC-6 18DX3 is a highly efficient and robust tool with unsurpassed accuracy and precision for wafer grinding, lapping, and polishing applications. It is suitable for applications ranging from high quality packaging to solar cell production.