Used OKAMOTO ASM-100A #9143377 for sale

OKAMOTO ASM-100A is a wafer grinding, lapping, and polishing equipment used for removing material from wafers in the microelectronics industry. It can handle wafer sizes up to 150mm in diameter and 11mm in thickness. The system comprises of six workstations; lapping/polishing station, polishing pad station, manual grinding station, semi-automatic grinding station, wheel preparing station and post-treatment station. The lapping/polishing station uses rotary and linear motion to polish the wafer with diamond lapping and polishing media. It can produce a high precision surface with minimal warping or damage. The polishing pad station is equipped with rubber polishing pads and provides automated flatness monitoring for an accurate and controllable process. This station can handle wafers up to 12 inches in diameter. The manual grinding station is equipped with a high-precision spindle that enables manual grinding with diamond wheel dressers. This station can be used for precision grinding and removal of contaminants from the wafer surface. The semi-automatic grinding station is capable of grinding and polishing with a diamond grinding wheel. It operates at a high speed and can reach micron accuracy levels. The wheel preparing station is designed for dressing grinding wheels and adjusting loading parameters to obtain optimal results. It allows for accurate control and monitoring of the dressing process. Finally, the post-treatment station is used to clean and blow the wafer surface for a uniform finish. The unit is highly accurate and efficient, capable of producing low defect rates due to the high degree of stability and control of the workstations. It is also capable of producing high quality optical surfaces due to its advanced polishing process. The machine's high-speed processing and automation capabilities allow for rapid turnaround and cost savings over manual processes.