Used OKAMOTO ASM-100A #9257632 for sale

OKAMOTO ASM-100A is a precision wafer grinding, lapping and polishing equipment designed for processing and polishing of various types of wafer materials such as semiconductor, compound semiconductor and advanced materials substrates. This system is a highly efficient and cost-effective unit for bringing wafers to uniform flatness with a high level of accuracy. The overall machine includes a main unit and several independent process stations which can be used for various operations, including process control, grinding, alignment, lapping, and polishing. It can process material sizes ranging from 3 to 8 inches, and is able to polish a wafer up to 100 microns in thickness. ASM-100A tool is designed with a variety of features to accommodate precise grinding and polishing operations. It is equipped with a precision direct current (DC) motor, which provides a smooth and uniform operation without any need for calibration adjustment. Additionally, it uses a bell jar asset to prevent any contamination of the wafers during the process as well as an automated lapping model that ensures even polishing. The equipment's grinding plate consists of a rapidly rotating diamond plated disc housed within an adjustable speed controller. This enables the user to select the desired polishing speed, from 20 to 1000 RPM, which is monitored in real time using a digital control panel. Additionally, the diamond plated disc is dynamically balanced to ensure a high level of accuracy during grinding and polishing. The lapping station consists of a pneumatic driven lapping plate, designed to reduce the surface roughness of the substrate by polishing particles. The polishing station consists of a planetary-like polishing head that is equipped with a high-performance piece of equipment called a polisher. This designed piece of equipment is designed to rotate in two directions simultaneously while polishing, allowing for uniform and accurate polishing results with minimal variation. OKAMOTO ASM-100A is designed to offer flexible and powerful processes, engineered to meet exacting customer specifications. The system is designed to meet tight tolerances and provides the user with both high quality results and performance. Its range of features allows for precision polishing of wafers, with flexible process settings to suit a wide range of applications.