Used OKAMOTO ASM-100A #9273817 for sale

OKAMOTO ASM-100A
ID: 9273817
Inner circumference slicer.
OKAMOTO ASM-100A is a wafer grinding, lapping and polishing equipment designed for precision wafer processing. It is capable of grinding, lapping and polishing a variety of wafer sizes with tight process control and high-efficiency operation. ASM-100A features a robust, automated control system with programmable process settings and motion control. This allows for precise control over the polishing process, enabling efficient production. An integrated closed-loop unit also helps to ensure the accuracy of the polishing parameters and results. The machine is equipped with a direct spindle drive that provides high torque and unbeatable reliability. It also features a range of grinding stones with cylindrical and cone shape compositions for accurate lapping and polishing of wafers. OKAMOTO ASM-100A also features a wafer dwell time control mechanism that prevents excessive damage to the wafer surface during processing. ASM-100A also offers a host of customisable options such as custom illumination and optical antennas for added flexibility and precision. The tool also has a wide range of safety features such as emergency stop (EM) and safety lockouts. Overall, OKAMOTO ASM-100A is an accurate and reliable wafer grinding, lapping and polishing asset designed to provide consistent, high-precision results. It is an excellent choice for wafer processing applications and is widely used in the semiconductor industry.
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