Used OKAMOTO ASM 1G #9258192 for sale

OKAMOTO ASM 1G is a wafer grinding, lapping and polishing equipment that is used to finish and prepare the surface of wafers for subsequent process steps. The system provides a wide range of capabilities that enable manufacturers to create high quality surfaces. The unit is designed for high throughput and versatility so that it can handle a wide range of wafer orientations, including 4- and 8-inch diameter wafers. It is also capable of single- or dual-sided grinding, as well as double-sided lapping and polishing. The machine features a highly efficient OKAMOTO grinding unit which operates at high speeds of up to 30,000 rpm. The grinding unit employs a high performance electro-mechanical tool that is driven by a frequency converter and provides self-compensation of vibration effects. The unit is enclosed in a single cabinet to ensure controlled environment for the grinding process. The lapping and polishing process is executed by a dedicated lapping unit which is a three-stage loop polishing vehicle. The product is moved automatically from stage to stage and the parameters can be set to achieve the desired surface finish. The unit employs a high density plating solution which is dispensed by a built-in pump asset, and is also enclosed in a single cabinet to maintain a controlled environment. ASM 1G also includes a load/unload station which allows wafers to be loaded directly into the model. The load/unload station is equipped with a number of safety features to ensure the safety of personnel and the accuracy of the process. OKAMOTO ASM 1G is an advanced, high performance equipment that can achieve excellent surface quality on wafers with high throughput and consistent results. By combining high speed grinding, lapping and polishing, it is able to provide the surface finish necessary for advanced semiconductor production techniques.