Used OKAMOTO ASM-1HB #9143753 for sale

OKAMOTO ASM-1HB is a precision wafer grinding, lapping and polishing equipment designed for use in semiconductor production. It has the capability to grind and polish up to 25mm diameter silicon wafers, and is designed for ultra-precise operation. The system consists of several components; the main unit, the vibratory feeder, the wafer retainer and the grinding and polishing lapping rings, each of which is specifically designed for ASM-1HB unit. The main unit of OKAMOTO ASM-1HB houses the motor assembly and controller. This assembly can grind wafers with a constant flow of clean coolant to ensure uniform and consistent grinding. It features a high torque rated dc-brushless motor which provides variable speeds, a range of up to 120rpm, and a drive machine which produces both rotary and lateral motion. The vibratory feeder is used to transport wafers into and out of the grinding chamber. It consists of a steel hopper, a spring feed loader, a vibrator motor and an upper feeder conveyor. This feeder is designed to minimize contamination of the silicon wafers during the transfer process. The wafer retainer holds the processed wafers in place while the grinding and polishing process is conducted. This component is made of stainless steel and is designed for increased stability. It also features two independent adjustable vibration dampening systems for greater control of the grinding and polishing processes. Lastly, the grinding and polishing lapping rings are specifically designed for use with ASM-1HB tool. These rings are capable of producing an unparalleled amount of surface uniformity, as well as reducing damage to the wafers during the grinding and lapping process. Each ring also contains a specially designed honing wheel to make sure that all polishing operations reach the desired goals. Overall, OKAMOTO ASM-1HB is a robust and reliable grinder, lapper and polisher designed for precision grinding and polishing of silicon wafers in semiconductor production. It features a high torque rated motor, a vibratory feeder, a wafer retainer, and specialized grinding and polishing lapping rings all designed to produce a high quality, uniform finish on silicon wafers. It is an ideal asset for achieving excellent results in wafer processing applications.