Used OKAMOTO ASM-1HB #9269787 for sale

OKAMOTO ASM-1HB is a wafer grinding, lapping and polishing equipment designed for the rapid fabrication of semiconductor devices. It provides a reliable and efficient way to create high quality devices through the grinding and polishing of wafer surfaces. The system is designed to quickly process large volumes of wafers in a single pass. The heart of the unit is the grinding and polishing head, which uses a combination of diamond grinding disks and polishing pads to provide a high quality, reliable surface finish. The head is attached to a motorized, adjustable gantry, which moves the head around the wafer and allows operators to accurately control grinding and polishing parameters. The machine also includes a vacuum chuck to firmly hold the wafer in place during processing. The tool can be used for edge rounding, back grinding, lapping, polishing, thinning, and more. It is capable of processing wafers of various sizes and can process both semiconductor and non-semiconductor materials. The asset's modular design allows it to be easily upgraded and improved with new hardware and software components. ASM-1HB is an ideal choice for manufacturers who need to quickly produce large quantities of high quality devices. The model is capable of quickly producing devices with consistent thickness, surface finish, and shape. Its user-friendly design also makes it easier to operate, making it a great choice for operators with limited experience. With its advanced features and robust design, OKAMOTO ASM-1HB is a reliable and efficient wafer grinding, lapping and polishing equipment.