Used OKAMOTO CC-350D #9168872 for sale

OKAMOTO CC-350D is a multi-purpose, high-precision wafer grinding, lapping, and polishing equipment. It is ideal for applications in which small wafers are to be processed for a wide range of high-end device technologies. This system features a three-axis motion control unit to enable high accuracy and excellent surface qualities in a short time frame. CC-350D has an automated table feed for a maximum wafer size of up to 300mm and a minimum table feed of 0.5mm. The unit is capable of interchanging between grinding and polishing modes and is ideal for the lapping and polishing of semiconductor wafers. The unit equips an automated wash nozzle for easy cleaning and lubrication of processed wafers. Within the machine includes a variety of advanced features such as the programmable spindle speeds, a wafer rotation control feed tool, and an automated safety cover. This flexibility makes the asset efficient and highly efficient for users. The model has been designed and tested for superior safety and reliability. Metal plates and aluminum poles are employed to ensure even pressure and uniform results. The equipment is designed with automated gap and level detection systems so that the lapping stage can be accurately adjusted to the user's specifications. OKAMOTO CC-350D is operated with a highly integrated digital graphic control interface. All essential adjustments, such as feed and rotation speed, and the position of the processed wafer will be processed via this interface to ensure the highest level of performance. The unit is also equipped with an electronic water pick-up and filtration system to ensure the highest level of wafer protection. CC-350D is an efficient, reliable, and versatile wafer grinding, lapping, and polishing unit which provides superior quality and precision with minimal effort and time. This machine is an ideal choice to meet the needs of manufacturers in the semiconductor industry for high precision applications.