Used OKAMOTO GDM 300 #9157552 for sale

OKAMOTO GDM 300 is an advanced, automated grinding, lapping and polishing equipment, designed for high-precision processing of large wafers and thin slice substrates up to 12"/300 mm in diameter. The system's unique construction makes it easy to incorporate into a process line or stand-alone application. Built from a rugged aluminum alloy, GDM 300 features a precision double roller chuck to securely hold wafers or substrates and ensure superb flatness. The wafer grinding unit controls up to 3 grinding and polishing heads, each independently adjustable to provide excellent repeatability and surface finish. The high torque spindle motors ensure reliable operation and fast processing. The Angle & swipe regulator lets you quickly change the rotation direction to control the polishing head power. To facilitate the grinding process, OKAMOTO GDM 300 also offers integrated spray cleaning nozzles for greater accuracy and superior surface quality. GDM 300 also features a number of automated functions like the Quick Abrasive Change Machine which ensures fast and repeatable process times. Meanwhile, the Automatic Process End Detector feature helps ensure optimal end-point accuracy and cycle time performance. OKAMOTO GDM 300's advanced control systems ensure excellent reliability and versatility. The tool interface provides easy, intuitive operation and data collection, with the ability to save process data and recipes for improved repeatability. GDM 300 can easily be integrated with a wide range of programmable controllers and robots to simplify complex grinding and polishing tasks. OKAMOTO GDM 300 is the perfect wafer grinding solution for users who demand superior performance in a user-friendly asset. With its rich features and reliable output, GDM 300 is a reliable, cost-effective model for refined grinding and polishing applications.