Used OKAMOTO GNX 200 #293615643 for sale

OKAMOTO GNX 200 is a state-of-the-art wafer grinding, lapping & polishing equipment used for high precision backside grinding of semiconductor wafers. It was developed by OKAMOTO Machine Tool Works, a leading Japanese machine tool manufacturer, to provide reliable and accurate grinds and polishes for precision applications. OKAMOTO GNX200 features an interchangeable grinding spindle and a powerful motor drive. Its base is equipped with a vacuum table, which provides superior dust and particle extraction. GNX 200 also includes an advanced grinding system, which consists of a programmable strobe oscillator and a high-speed spindle motor that provide high accuracy and speed. Additionally, GNX200 offers a large and ergonomic worksurface with adjustable working height and easy-to-access operating and safety controls. OKAMOTO GNX 200 is capable of both single-sided and double-sided grinding, suitable for flat or contoured surfaces. Its high-precision spindle is capable of up to 12,000 rpm, enabling it to handle a variety of materials including alumina, glass, and metal. OKAMOTO GNX200 is equipped with diamond and superabrasive wheels to ensure superior surface finish during the grinding process. In addition to its grinding capabilities, GNX 200 also features automated lapping and polishing capabilities. The lapping station has a collision-protection unit that regulates the tool motion for maximum safety. The polishing station can be manually or automatically controlled, with a vacuum-sealed clean room to ensure low contamination levels. Overall, GNX200 is an effective and reliable machine that is well-suited for tight-tolerance semiconductor wafer grinding, lapping and polishing applications. Its flexible and efficient design, combined with its high-precision capabilities, make it an excellent choice for precision grinding and polishing of wafers.