Used OKAMOTO GNX 200 #9315345 for sale

OKAMOTO GNX 200 is a fully automated system for grinding, lapping, and polishing wafers. This machine has the capacity to grind and polish up to 25 wafers in parallel, with a maximum wafer diameter of 200mm. OKAMOTO GNX200 is built with a robust and reliable construction to provide a long service life and improve production yields. The unique surface grinding mechanism of GNX 200 offers superior processing accuracy. The integrated linear motor reduces grinding time and optimizes control, resulting in high-quality surfaces with low average surface roughness. An advanced grinding method minimizes vibration, resulting in improved accuracy and repeatability of results. GNX200 is equipped with a recirculating double-edge lapping option which allows continuous flow without the need for manual intervention. This yields higher throughput compared to traditional single-edge lapping methods. Furthermore, the adjustable feed rate allows precise control of the part surface quality. The integrated polishing unit maximizes flatness and the surface finish quality. OKAMOTO GNX 200 is equipped with an automated polishing feature that accurately select appropriate polishing sectors based on the diameter and number of wafers. This results in better processing times and improved surface finish quality. In addition, OKAMOTO GNX200's fast and accurate software features dramatically reduce set-up time and training requirements. This enables quick and easy processing of wafers. Overall, GNX 200 provides a high level of accuracy and precision in grinding, lapping, and polishing wafers. It is an ideal tool for those in the semiconductor industry who require a consistent surface finish on larger wafer sizes. The wide range of options and software features make it a versatile system that can meet a variety of production needs.