Used OKAMOTO GNX 200 #9394971 for sale

OKAMOTO GNX 200 is a premier wafer grinding, lapping & polishing equipment that offers superior performance. This wafer grinding, lapping & polishing system uses a combination of techniques for the fabrication and polishing of high-precision wafers. OKAMOTO GNX200's advanced design and superior technology make the unit capable of producing ultra-fine surface finishes with optimal process efficiency. The machine is comprised of an integrated grinding, lapping & polishing head along with a precision support mechanism and a complete wafer handling tool. The integral grinding head utilizes a single-point diamond-grinding wheel with an SDC indexer for grinding and polishing wafers up to 100mm in diameter. A steel backing plate is also included to support the wafer during the grinding and polishing process. The lapping head allows for high-precision lapping of up to 4 opposite surfaces on a single wafer simultaneously. It features an auto-leveling chuck to ensure uniform contact with the wafer. The lapping plate is available in a variety of materials and sizes depending on the polishing needs and materials of the wafer. Polishing is accomplished using a polishing pad that has been designed to apply easily and reduce edge dishing. The pad is capable of polishing both UP and SSP wafers, and is available in a variety of sizes and materials for different wafer materials and applications. The wafer handling asset is a powerful yet easy to use 3D motion control model. It allows for precise support of the lapping/polishing process utilizing a single pneumatic-driven handling table. The table features Z-axis adjustment to assist in maintaining a uniform initial gap in grinding/lapping plates and the wafer surface. Overall, GNX 200 is an advanced wafer grinding, lapping & polishing equipment which provides superior performance, high accuracy, and enhanced flexibility to suit a variety of wafer processing requirements. The system's efficient design ensures minimal damage to the wafer while at the same time achieving ultra-fine surface finishes.