Used OKAMOTO GNX 200B #293760387 for sale

OKAMOTO GNX 200B is a state-of-the-art wafer grinding, lapping, and polishing equipment that offers the highest precision and surface finish for various types of wafer fabrication processes. GNX 200B provides the highest level of accuracy and quality for grinding, lapping, and polishing of wafers and other substrates for semiconductor wafer fabrication, optical components, MEMS and related industries. OKAMOTO GNX 200B is a dual spindle wafer grinder, lapper, and polisher. It is equipped with two high-power grinding spindles and two asynchronous polishing spindles that rotate at programmable speeds. The machine comes with an advanced drive system and a high-resolution data input computer interface. The machine's advanced micro-processing technology enables precise, repeatable grinding and polishing of different types of substrates and materials. It is also equipped with a highly-sensitive feed arm to ensure that the desired amount of material can be delivered between each grinding cycle. The machine can be used for surface grinding, lapping, polishing, and other delicate surface finishing operations. It is capable of achieving precise surface flatness, surface roughness and dimensional tolerances. GNX 200B possesses a variety of mechanical and electrical components including a micro-processing unit, high-resolution encoders, dual-driven spindles, and a range of motion-controlled servo motors and drivers. All these components are designed to provide the machine with a high degree of accuracy, repeatability, and smooth surface finish on a variety of different materials. OKAMOTO GNX 200B is specifically designed for wafer grinding operations and is capable of producing high-quality results with little or no manual intervention. The machine's interface allows users to store and recall complete recipes to quickly reproduce the desired processing steps and achieve consistent surface finishes from batch to batch. In addition, the machine has an auto-calibration feature that checks the machine's grinding and polishing parameters before and after each batch. This ensures consistently high-quality results as well as precise and repeatable machining results. The machine's easy-to-use graphical user interface simplifies the entire operation by providing graphical representations of grinding and polishing results. Overall, GNX 200B is an advanced wafer grinding, lapping, and polishing machine that offers the highest precision and surface finish available on the market for a variety of wafer fabrication processes. It features a high degree of accuracy, repeatability, and smooth surface finish, and is simple to use with its graphical user interface and powerful mechanical and electrical components.