Used OKAMOTO GNX 200B #9204618 for sale

OKAMOTO GNX 200B is a high-precision, multi-functional wafer grinding, lapping, and polishing equipment, designed for the high-performance applications of the most stringent semiconductor device manufacturing processes. Built on advanced and reliable OKAMOTO Linear Motor technology, GNX 200B offers exceptional precision control with a straightforward, user friendly interface. With a dedicated powerful linear spindle motor, ultra-fast X/Y/Z axes, and a wide variety of accessories, OKAMOTO GNX 200B is capable of grinding and fine-polishing a variety of bright, shiny surfaces. This includes making mirror-like patterns on the surface of Si, Ge, SiO, and other materials. GNX 200B features a digital closed-loop position-control loop system, integrated mapping functions, and a 6-axis simultaneous control unit. This allows the user to accurately position the wafer for all grinding or polishing operations. The additional lapping feature can be used for drilling, sanding, etching, and fine-sanding of the wafer surface. OKAMOTO GNX 200B uses advanced, proprietary grinding-head technology to deliver high accuracy and superior surface finish. The software platform is intuitive and easy to use, allowing users to save time and reduce operation errors. To further facilitate accurate operations, the friction-free design minimizes loading forces while eliminating dust accumulation. Additionally, GNX 200B features anti-vibration measures, allowing it to maintain consistent and repeatable grinding operations. In order to deliver optimal performance, OKAMOTO GNX 200B is equipped with a high-precision rotary table and a built-in temperature compensation machine. This is used for edge deburring and honing operations. The rotary table can also be independently used for lapping, polishing, or slicing. Furthermore, GNX 200B comes with a built-in vacuum cleaner for efficient cleaning and dust removal. The vacuum cleaner is equipped with advanced sensors that can detect the shape of the grinding head and adjust the vacuum pressure accordingly. OKAMOTO GNX 200B also features an in-built 12 inch LCD monitor and an integrated logic control tool. GNX 200B is a highly efficient and reliable automated wafer grinding, lapping and polishing asset designed to meet the demands of the most stringent semiconductor device manufacturing processes. The model's reliable performance, error-proofing capabilities, and user-friendly interface make it an ideal choice for any wafer-processing application.