Used OKAMOTO GNX 300 / 12PB #293671755 for sale

OKAMOTO GNX 300 / 12PB Wafer Grinding, Lapping and Polishing equipment is a highly advanced CNC-controlled polishing system that allows for simultaneous grinding, lapping and polishing of wafer parts up to 300mm in diameter. This unit uses proprietary patent pending technology to achieve the highest level of planarity, micro-finish, and substrate cleanliness with an exceptional level of speed, precision, and repeatability. This unique machine combines a belt-driven 11-axis CNC tool with high precision grinding, lapping and polishing heads which can be tailored to a wide variety of process requirements. The GNX 300 includes a precision grinding/lapping wheel mounted to a CNC machine bed, a CNC control unit, and a cooling asset that keeps the model temperature within the specified operating range. The grinding/lapping process is driven by precision servo and stepper motors with scanning abilities that allow it to detect and correct flaws/defects in the wafer. Additionally, the high speed spindle motor enables the equipment to reach speeds of up to 10m/sec, providing superior output and process capability. The system is also highly efficient and improves wafer production yields, as it can automatically inspect the wafer surface, identify any defects, and automatically adjust the processing parameters accordingly. This unit can also be configured for multi-head grinding/lapping processes, allowing it to process up to 8 wafers simultaneously, or 6 multiple dies in the same shot. Additionally, this machine can process wafer parts using two different techniques to achieve one planar surface. In terms of technological capability, the GNX 300 is equipped with a host of advanced technological features such as electronic proportional valve (EPV) tool, servo-driven grinding-lapping spindle, dual position spindle, air cooling, ACS control asset and multi-axis control. Other features such as the powerful, high-speed grind motor and cooling model ensure an optimal level of process accuracy and efficiency. Additionally, the advanced digital feedback and control systems allow for precise process control and monitoring. Overall, GNX 300 / 12PB wafer grinding, lapping and polishing equipment is a powerful and innovative wafer production tool that is capable of producing high quality wafer parts with an exceptional level of speed, accuracy and repeatability. It is equipped with advanced technological features that ensure superior output and process capability as well as improved wafer production yields.