Used OKAMOTO GNX 300 Grind-X #293663354 for sale

OKAMOTO GNX 300 Grind-X is a versatile and powerful wafer grinding, lapping, and polishing equipment. Designed for precision and accuracy, GNX 300 Grind-X features a 5-axis motion control system that enables automated grinding, lapping, and polishing operations, as well as manual operation. OKAMOTO GNX 300 Grind-X is a rugged and reliable machine that is capable of handling a variety of materials including silicon, GaAs, ceramic, and stainless steel. The precision grinding, lapping, and polishing technology ensures high accuracy, low damage, and high yield, making it ideal for high volume production. GNX 300 Grind-X is equipped with a range of features designed to ensure high performance and durability. It includes an arrangement of sensors to detect workpiece position, an in-line cooling unit for temperature control, and a range of custom grinding and polishing tools. OKAMOTO GNX 300 Grind-X machine is modular and can be configured to suit specific requirements. It features precise and repeatable friction, lapping, and polishing motions, with the unique ability to process up to 12 different pieces simultaneously. GNX 300 Grind-X is designed to be user friendly and is equipped with an intuitive control panel and communication interface, which can be connected to a wide variety of peripheral equipment. The tool can be set up to provide real time feedback and to alert the operator when certain parameters are met, ensuring quality control and good process management. In conclusion, OKAMOTO GNX 300 Grind-X is an ideal wafer grinding, lapping, and polishing asset for precision and accuracy. With its powerful 5-axis motion control model, range of custom grinding and polishing tools, precise motion control, and modular, user-friendly design, it offers an ideal solution for high volume production with minimal downtime and excellent yields.