Used OKAMOTO GNX 300 #293638015 for sale

OKAMOTO GNX 300 is a state-of-the-art machine designed to support the precise grinding, lapping and polishing of wafers in semiconductor manufacturing. Through advanced technologies, OKAMOTO GNX300 is capable of achieving nanoscale accuracy and repeatability with high throughput and low cycle times. The highly stable and rigid structure of GNX-300 ensures precise and repeatable machining, providing improved wafer yields and lower costs. OKAMOTO GNX-300 incorporates a total of 16 axes - 9 grinding axes, 4 polishing axes, and 3 lapping axes. This allows for a high degree of flexibility for wafer processing and is ideal for applications such as die attach, RF antenna, and photonic component grinding and polishing. The machine's grinding head is composed of three rotary independent tools, enabling uniform and repeatable processing conditions for each wafer step. Additionally, GNX300 includes a wafer transport system for transferring wafers between machines. The machine features a small footprint, requiring only 7.1 sq m of space to accommodate the machine and its peripheral systems. GNX 300's use of a heavy duty FEA optimized plate frame structure and vibration control method enables high speed operation with minimized vibration, thus ensuring high processing quality. The machine also features a 'great innovation' in-line loading and unloading system which allows a single operator to perform both tasks in a single step. OKAMOTO GNX 300 supports a wide variety of wafer types and sizes, up to a maximum diameter of 4-inch (100mm). Other specifications include a maximum spindle speed of 30,000 rev/min, and a maximum table speed of 300rpm. With a maximum grinding depth of 0.9 mm, OKAMOTO GNX300 provides cost-effective grinding and polishing of demanding applications. In addition, the machine's easy-to-use Graphic User Interface (GUI) provide simple operation and high throughput efficiency. The advanced technologies utilized in GNX-300 system effectively improve the overall quality of wafer processing, and helps to reduce process cost and cycle time. OKAMOTO GNX-300 is designed to provide an economical and efficient solution for semiconductor wafer processing applications.