Used OKAMOTO GNX 300 #293659983 for sale

OKAMOTO GNX 300 is a wafer grinding, lapping & polishing equipment that is used to produce highly accurate and precise surfaces on silicon and compound wafers. It offers superior performance and excellent productivity on both flat and curved wafers. OKAMOTO GNX300 utilizes a unique grinding method to achieve high throughput and surface quality in a single pass. This device also offers outstanding flexibility and is appropriate for a wide range of wafer sizes and shapes. GNX-300 is equipped with an adjustable grinding spindle that is capable of accommodating various grinding wheels with different wheel facing angles and concentricity tolerances. It is also equipped with a foil supply unit and a winding unit as well as an oscillating platen. The device is further equipped with a precision linear motorized stage for precise wafer positioning and handling. GNX 300 utilizes a computer-controlled grinding process with a semi-automatic measurement and adjustment system for grinding performance optimization. This unit ensures that the wafers remain flat and free of center and edge bulges. This precision alignment is achieved through the use of an advanced optical profiler, which is used to measure the shape of the wafer before and after the grinding process. This profiler can be used to adjust the grinding parameters such as wheel speed and feed rate, which allows for higher quality and higher precision surface finishes. GNX300 is capable of achieving excellent surface finishes and high surface flatness on any type of wafer. In addition, it is equipped with a polishing machine which allows for quick and easy polishing of high aspect ratio wafers. This high precision polishing tool enables users to achieve even more perfect surfaces with high flatness and low surface roughness. OKAMOTO GNX-300 is also equipped with a special tool for grinding and lapping of wafers with different thicknesses. This tool allows users to achieve uniform polishing of wafer to achieve the highest quality surface finishes. Overall, OKAMOTO GNX is an exceptional wafer grinding, lapping & polishing asset that is capable of producing high quality and highly precise surfaces for different types of wafer. With its advanced technology and superior performance, this model is perfect for all types of wafer fabrication.