Used OKAMOTO GNX 300 #9014254 for sale

OKAMOTO GNX 300 is a wafer grinding, lapping and polishing equipment designed to provide high precision surface finish on a variety of materials, including silicon, quartz, ceramic and semiconductor substrates. The system combines the latest in grinding, lapping and polishing technologies to provide users with unparalleled performance and reliability. OKAMOTO GNX300 is equipped with an air-cooled industrial grade spindle, capable of performing grinding, lapping and polishing operations at speeds ranging from 2,000 RPM to 15,000 RPM. The spindle is controlled by a three-axis direct drive servo motor unit and is able to produce extremely fine surface finishes on hard or brittle wafers. The precise in-production control of the spindle allows for the production of high accuracy results. GNX-300 also features a high-resolution, digital imaging machine for monitoring the progress of every operation and ensuring tight process control. This includes a high-magnification camera that can magnify and display up to 600x when used in conjunction with strobe lighting, allowing for immediate inspection of surface defects and topographic features. All images taken can be stored and compared against references stored on the tool and tracked over time. The asset is also equipped with safety features designed to protect both the operator and the equipment. These include a safety interlock that prevents accidental activation and a locking device to prevent unauthorized access to the model. GNX300 also features a flexible process chamber with a 300mm working range and a wide range of customizable grinding, lapping and polishing wheels. OKAMOTO GNX-300 also offers a range of integrated automation systems and intuitive user interface software to streamline operation. The integrated graphically-oriented software allows for programmable tuning of the grinding parameters, making it quick and easy to set up multiple production runs. The equipment also features an integrated loop control system which ensures tight process control is maintained over the duration of the wafer run. GNX 300 is an innovative wafer grinding, lapping and polishing unit that offers enhanced productivity, improved surface precision and safe operation. By combining efficiency and performance, OKAMOTO GNX 300 is the ideal machine for advanced wafer processing operations.