Used OKAMOTO GNX 300 #9029080 for sale

OKAMOTO GNX 300
ID: 9029080
Wafer Size: 12"
Back grinder, 12".
OKAMOTO GNX 300 is a wafer grinding, lapping & polishing equipment specifically designed to simplify and enable the grinding, lapping and polishing of wafers up to 300mm in diameter. With an extensive lineup of models to choose from, OKAMOTO GNX300 system provides users with the flexibility and capabilities to meet the demands of a broad range of processing needs. GNX-300 features a number of innovations that make it an ideal wafer grinder. This includes a state-of-the-art machine controller that enables users to programme intricate grinding, lapping, and polishing processes, as well as the ability to adjust feed speeds to minimize material wastage and increase process accuracy. This machine also features an advanced high-speed spindle, making it highly capable of executing ultra-precise grinding operations. It also ensures quiet and vibration-free operation. Coupled with an extremely robust spindle unit drive, the unit can handle intensive grinding, lapping and polishing processes at a high speed. OKAMOTO GNX-300 features a range of optional extras, which include a variety of grinding and polishing accessories, such as polishing pads, grinding wheels, and an additional spindle unit, to enable customized operation that is tailored to suit customer needs. GNX 300 is powered by a fully enclosed motor, enabling safe and comfortable operation. It features a sophisticated micro-step drive machine to minimize machine vibration, and its integrated coolant tool helps to keep the temperature down during polishing and grinding operations. GNX300 also offers users the opportunity to select either standard grinding and lapping processes or use OKAMOTO GNX-CAM software interface to create customized grinding and polishing processes. This allows users to design highly customized grinding and polishing processes that are tailored to their needs. OKAMOTO GNX 300 is an ideal tool for use in a broad range of industries. From automotive manufacturing to semiconductor production, this wafer grinding, lapping & polishing asset offers the precision and efficiency in its operation, and its range of attachments allow for a customizable production line that suits the user's needs.
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