Used OKAMOTO GNX 300 #9034900 for sale

OKAMOTO GNX 300 is an advanced wafer grinding and polishing equipment incorporating a multi-step process to achieve a higher precision finish with enhanced uniformity. This system is capable of producing wafer diameters from 2 inches to 300 mm with a surface finish down to 0.2 Ra (roughness average) or better. OKAMOTO GNX300 grinding, lapping and polishing unit utilizes a robotic wafer carrier machine, an advanced self-containing spindle and drive tool, and a cutting edge, computer controlled grinding, lapping and polishing process. Grinding is the first step used in the lapping and polishing process and it involves roughing and levelling the surface of the wafer. GNX-300 uses an advanced robotic wafer carrier asset that can handle wafers with a diameter of up to 300 mm. The carrier model allows wafers to be loaded and unloaded quickly and easily, enabling faster cycle times. The cutting edge grinding components and computer control algorithms ensure precision and the highest surface finish quality for every grinding cycle. The lapping process really refines the surface of the wafer, removing grinding scratches and further improving the surface finish and creating better uniformity. OKAMOTO GNX-300 uses a self-contained spindle and drive equipment for much faster, more accurate results. The system maintains a constant speed, allowing for smoother lapping and greater control over the process. Furthermore, its cutting edge technology enables the user to adjust speed, pressure, time and more during the process. Finally, the wafer goes through the polishing process, which improves the surface finish even further. GNX300 offers a unique, computer-controlled polishing process. This process eliminates scratches, making it easier to maintain the desired surface finish. The combination of cutting edge technologies such as the robotic wafer carrier, self-contained spindle, and computer control algorithms ensure high accuracy and excellent surface finish quality for every cycle. Overall, GNX 300 is a powerful wafer grinding, lapping and polishing unit that offers a unique combination of techniques and features. With its multi-step process and breakthrough technologies, it helps fabricate wafers with a higher uniformity and precision finish. With its fast cycle times and advanced robotic handling machine, it offers a cost-efficient way to achieve the highest wafer surface finishes possible.